By Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou
Applications of Finite point tools for Reliability experiences on ULSI Interconnections offers an in depth description of the appliance of finite point equipment (FEMs) to the examine of ULSI interconnect reliability. over the last 20 years the appliance of FEMs has turn into frequent and keeps to guide to an improved realizing of reliability physics.
To aid readers focus on the expanding sophistication of FEMs’ functions to interconnect reliability, Applications of Finite point tools for Reliability reports on ULSI Interconnections will:
- introduce the primary of FEMs;
- review numerical modeling of ULSI interconnect reliability;
- describe the actual mechanism of ULSI interconnect reliability encountered within the electronics undefined; and
- discuss intimately using FEMs to appreciate and increase ULSI interconnect reliability from either the actual and sensible point of view, incorporating the Monte Carlo method.
A full-scale evaluation of the numerical modeling technique utilized in the research of interconnect reliability highlights helpful and remarkable thoughts which have been built lately. Many illustrations are used in the course of the e-book to enhance the reader’s knowing of the technique and its verification. real experimental effects and micrographs on ULSI interconnects also are included.
Applications of Finite aspect equipment for Reliability experiences on ULSI Interconnections is an effective reference for researchers who're engaged on interconnect reliability modeling, in addition to in case you need to know extra approximately FEMs for reliability functions. It offers readers a radical knowing of the functions of FEM to reliability modeling and an appreciation of the strengths and weaknesses of varied numerical versions for interconnect reliability.
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Extra resources for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
This implies that the stress state of via is significantly different from that of lines and deformation will occur mainly in the via and not in the lines. Similar modeling work can also be found in other references [55, 63]. The scaling effect on the thermo-mechanical stress in interconnect was addressed in the work of Ho et al. through beam bending measurement . It was found that with decreasing line dimensions, the confinement due to the surrounding materials was enhanced and the stress level was increased sufficiently to cause void formation.
Korhonen MA, Black RD, Li C-Y (1993) Stress evolution due to electromigration in confined metal lines. J Appl Phys 73:3790–3799 73. Zhai CJ, Blish RC (2005) A physically based lifetime model for stress-induced voiding in interconnects. J Appl Phys 97:113503 74. Fischer AH, Zitzelsberger AE (2001) The quantitative assessment of stress-induced voiding in process qualification. In: Proceedings of 39th IEEE/IRPS conference, Orlando, Florida, IEEE, New York, pp 334–340 75. Tan CM, Hou Y (2007) Lifetime modeling for stress-induced voiding in integrated circuit interconnections.
Compared with FEM, analytical modeling of stress components is more useful to extract quick estimates and to gain a greater insight into the mechanics and physics of the stress evolution. The early analytical models were based on the 26 2 Physics-Based Modeling for ULSI Interconnections Failure Mechanisms Eshelby theory of inclusions in which the line was modeled as an ellipsoidal cylinder embedded in an infinite isotropic matrix of the passivation material [60, 64]. However, these models did not capture the interaction between neighboring lines as well as the elastic properties of the substrate or sharp edges of the line.
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections by Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou